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Future Electronics for Industry 4.0 and Medical 4.0 - TN02000067

Future Electronics for Industry 4.0 and Medical 4.0 - TN02000067
OZNAČENÍ: FEIM
PROGRAM: Národní centra kompetence II
POSKYTOVATEL: Technologická agentura ČR
DOBA ŘEŠENÍ: 1.1.2023 - 31.12.2028
KOORDINÁTOR: ČVUT Praha
WEB: https://feim.cvut.cz/

COC is involved in 6 sub-projects focused on the use of conductive and semi-conductive non-metallic materials in the field of printed electronics:

DP001N – Sensors and Systems for Healthcare. COC investigates organic materials suitable for the construction of large-scale sensors enabling rapid response in the field of remote healthcare.

DP002N – Sensors and systems for Industry 4.0. COC prepares materials suitable for large-scale sensors intended for storage and industrial applications.

This project is financed under the National Recovery Plan by the European Recovery and Resilience Facility.

DP010 – Printed Electronics. COC coordinates this sub-project. His activities are focused on In Mold Electronics systems and using conductive mainly non-metallic electronic devices. Circuit and sensor structures are applied by printing with new nanostructured carbon materials.

DP008 – Human Machine Interface. The sub-project aims to design printed capacitive sensors for touch screens in such a way as to increase the flexibility of the construction options of these control elements, also with the aim of industrial use. For conductive elements, non-metallic materials are proposed, the preparation of which is feasible in the EU.

DP003 – Printed elements and systems on ceramic substrates. COC designs conductive inks based on bimodal copper particles that enable accurate and fast application to a new type of substrates with high thermal conductivity. At the same time, COC cooperates in the design of new types of printable dielectric materials.

DP014 – Electronic systems integrated into a textile substrate. COC coordinates the sub-project and its activities are focused on conductive hybrid textile materials combining metallic interconnections with conductive polymers, which increase the flexibility and applicability of conductive textile materials. The long-term goal is the complete integration of sensor elements into the textile structure.